師資
吳勇波,，1997年3月獲日本東北大學（Tohoku University）博士學位,，2017年全職回國任教前在日本先后擔任尼康公司主任級工程師,、東北大學助理教授,，日本秋田県立大學講師/副教授/終身正教授,、研究室主任,；歷任日本磨粒加工技術(shù)學會理事,、國際磨粒技術(shù)委員會委員,、 國際微納機械加工制造學術(shù)研討會ISMNM系列組委會主席,、國際納米制造學會會士,。在精密加工制造領(lǐng)域開展了多年的科研教學工作，率先在國際上提出多場輔助精密加工概念,，并開展了一系列前瞻性的原創(chuàng)性研究,。發(fā)表學術(shù)論文200余篇，日本專利16項,，中國專利25項,，參與撰寫英、日文著作5部,，在國內(nèi)外做特邀或邀請報告數(shù)十場,。先后在日本和國內(nèi)承擔科研項目近50項，獲得日本競爭性研究經(jīng)費3億余日元,，中國近5000萬元,。
研究領(lǐng)域：
◆ 超聲輔助精密加工工藝與設(shè)備
◆ 基于磁流變效應的納米精度研拋工藝與設(shè)備
◆ 固相化學反應利用/超聲輔助復合加工工藝與設(shè)備
◆ 生物組織的橢圓超聲切除機理研究與超聲手術(shù)器械的研發(fā)
學習經(jīng)歷：
◆ 1978.10 - 1982.07：合肥工業(yè)大學 ,，機械制造工程，學士
◆ 1982.09 - 1985.02 ：北京航空航天大學,，航空制造工程,，碩士
◆ 1992.04 - 1997.03 ：東北大學(日本)，精密工學工程,，博士
工作經(jīng)歷：
◆ 2017.05 - 現(xiàn)在 南方科技大學,，講席教授
◆ 2007.04 - 2017.04 秋田県立大學 教授，研究室主任
◆ 2004.04 - 2007.03 秋田県立大學,，副教授
◆ 2000.04 - 2004.03 秋田県立大學,，專任講師
◆ 1998.07 - 2000.03 東北大學(日本)，助理教授
◆ 1997.04 - 1998.06 尼康公司,，主任級工程師
◆ 1991.10 - 1992.03 東北大學(日本),，客座研究員
◆ 1989.06 - 1991.09 南昌航空大學，講師
◆ 1987.10 - 1989.05 豐橋技術(shù)科學大學,，訪問學者
◆ 1985.03 - 1987.09 南昌航空大學,，助教
所獲榮譽：
◆ 2020年入選佛山市南海區(qū)高層次人才二類
◆ 2018年入選深圳市南山區(qū)“領(lǐng)航人才”A類
◆ 2017年入選深圳市海外高層次人才“孔雀計劃”A類
◆ 2012，F(xiàn)ellow, International Society of NanoManufacturing (ISNM)
◆ 2013,，Representative, Japan Society for Precision Engineering (JSPE)
◆ 2012,， Advisor/Supervisor of outstanding young scholar Award Winnerat 12theuspen，Stockholm, Sweden,
◆ 2013,，Advisor/Supervisor of best paper Award Winner at 8th LEM21, Matsushima, Japan
◆ 2014,，Advisor/Supervisor of outstanding young scholar Award Winner at 14theuspen, Dubrovnik, Croatia,
◆ 2015，Advisor of best paper Award winner at 11th CJUMP, Itabashi, Tokyo, Japan
◆ 2011年江西省“贛鄱英才555工程”第一批入選者
◆ 2009,，30th Machine Tools Technology Award, Japanese Machine Tools Technology Promotion Foundation
◆ 2004,，Best Paper Award of JSAT (Japan Society for Abrasive Technology)
◆ 2002，Kumagai Award of JSPE (Japan Society for Precision Engineering)
◆ 1999,，Manufacturing and Machine Tool Research Award of JSME (Japan Society of Mechanical Engineers)
科研成果：
◆ 學術(shù)論文200余篇,，參與撰寫英日文學術(shù)著作5部,，申請專利40余項
◆ 承擔日本及中國科研項目近50項
◆ 深圳市海外高層次人才創(chuàng)新創(chuàng)業(yè)團隊帶頭人,，2019
◆ 佛山市科技創(chuàng)新團隊帶頭人，2019
代表性學術(shù)論文：
1. Weixing Xu, Yongbo Wu*, Piezoelectric actuator for machining on macro-to-micro cylindrical components by a precision rotary motion control, Mechanical Systems and Signal Processing, 114 (2019) 439-447.
2. Ming Feng, Yongbo Wu*, Youliang Wang, Jiang Zeng b, Teruo Bitou, Mitsuyoshi Nomura a and Tatsuya Fujii, Investigation on the polishing of aspheric surface with a doughnut shaped magnetic compound fluid (MCF) tool using an industrial robot, Precision Engineering, 61 (2020) 182-193.
3. S. Li, Y. Wu*, M. Nomura, T. Fujii, Proposal of an ultrasonic assisted electrochemical grinding method and its fundamental machining characteristics in the grinding of Ti–6Al–4V, ASME Journal of Manufacturing Science and Engineering, 140 (2018) 071009-1-9.
4. W. Xu* and Y. Wu*, A novel approach to fabricate high aspect ratio micro-rod using ultrasonic vibration-assisted centreless grinding,，International Journal of Mechanical Sciences, 141 (2018) 21-30.
5. Q. Wang, Y. Wu*, T. Bitou, M. Nomura, T. Fujii, Proposal of a tilted helical milling technique for high quality hole drilling of CFRP: Kinetic analysis of hole formation and material removal, International Journal of Advanced Manufacturing Technology, 94 (2018) 4221-4235,，DOI 10.1007/s00170-017-1106-3
6. S. Li, Y. Wu*, K. Yamamura, M. Nomura, T. Fujii, Improving the grindability of titanium alloy Ti-6Al-4V with the assistance of ultrasonic vibration and plasma electrolytic oxidation, CIRP Annals Manufacturing Technology, 66,1 (2017) DOI: 10.1016/j.cirp.2017.04.089
7. Y. Wu*, S. Li, M. Nomura, S. Kobayashi, T. Tachibana, Ultrasonic assisted electrolytic grinding of titanium alloy Ti-6Al-4V, International Journal of Nanomanufacturing, 13, 2( 2017) 152-160.
8. S. Li, Y. Wu*, M. Nomura, Effect of grinding wheel ultrasonic vibration on chip formation in surface grinding of Inconel 718, Int. J. of Advanced Manufacturing Technology, 2016; DOI: 10.1007/s00170-015-8149-0.
9. Y. Wang, Y. Wu* and M. Nomura, Feasibility study on surface finishing of miniature V-grooves with magnetic compound fluid slurry, Precision Engineering, 45 (2016) pp.67-78.
10. S. Li, Y. Wu*, M. Nomura, Improving the working surface condition of electroplated cBN grinding quill in surface grinding of Inconel 718 by the assistance of ultrasonic vibration, ASME J. of Manufacturing Science and Engineering, 138 (2016) 071008-1_8.
11. D. Lu, Q. Wang, Y. Wu*, J. Cao, H. Guo, Fundamental Turning Characteristics of Inconel 718 by Applying Ultrasonic Elliptical Vibration on the Base Plane, Materials and Manufacturing Processes, 30, 8 (2015) 1010-1017.
12. J. Cao, Y. Wu*, J. Li, Q. Zhang, A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics, Int. J. of Advanced Manufacturing Technology, 81, 5 (2015) 875-885.
13. Y. Wang, Y. Wu*, H. Guo, M. Fujimoto, M. Nomura and K. Shimada, A New MCF (Magnetic Compound Fluid) Slurry and its Performance in Magnetic Field-assisted Polishing of Oxygen- free Copper, J. of Applied Physics, 117 (2015) 17D712-1_4.
14. H. Guo, Y. Wu*, D. Lu, M. Fujimoto, M. Nomura, Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry, J. of Materials Processing Technology, 214, 11 (2014) 2759-2769.
15. J. Cao, Y. Wu*, D. Lu, M. Fujimoto, M. Nomura, Material removal behavior in ultrasonic- assisted scratching of SiC ceramics with a single diamond tool, Int. J. of Machine Tools and Manufacture, 79 (2014) 49-61.
16. Y. Li, Y. Wu*, L. Zhou, M. Fujimoto, Vibration-Assisted Dry Polishing of Fused Silica Using a Fixed-Abrasive Polisher, Int. J. of Machine Tools and Manufacture, 77, 1 (2014) 93- 102.
17. L. Jiao, Y. Wu*, X. Wang, H. Guo, Z. Liang, Fundamental performance of magnetic compound fluid (MCF) wheel in ultra-fine surface finishing of optical glass, Int. J. of Machine Tools and Manufacture, 75 (2013) 109-118.
18. Z. Liang, X. Wang, Y. Wu, L. Xie, L. Jiao, W. Zhao, Experimental Study on Brittle - Ductile Transition in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire using Single Diamond Abrasive Grain, Int. J. of Machine Tools and Manufacture, 71 (2013) 41-51.
19. W. Xu, Y. Wu*, Simulation investigation of through-feed centerless grinding process performed on a surface grinder, Journal of Materials Processing Technology, 212 (2012) 927-935.
20. Y. Li, Y. Wu*, J. Wang, W. Yang, Y. Guo and Q. Xu, Tentative investigation towards precision polishing of optical components with ultrasonically vibrating bound-abrasive pellets, Optics Express, 20, 1 (2012) 568-575.
21. Y. Peng, Y. Wu*, Z.Q. Liang, Y. B. Guo and X. Lin, An Experimental Study of Ultrasonic Vibration-assisted Grinding of Polysilicon Using Two-Dimensional Vertical Workpiece Vibration, Int. J. of Advanced Manufacturing Technology, 54 (2011) 941-947.
22. W. Xu and Y. Wu*, A new in-feed centerless grinding technique using a surface grinder J. of materials Processing Technology, 211 (2011) 141-149.
23. Z. Liang, Y. Wu*, X. Wang, W. Zhao, T. Sato, W. Lin, A New Two-dimensional Ultrasonic Assisted Grinding (2D-UAG) Method and Its Fundamental Performance in Monocrystal Silicon Machining, Int. J. of Machine Tools and Manufacture, 50 (2010) 728-736.
24. W. Xu, Y. Wu*, T. Sato, W. Lin, Effects of process parameters on workpiece roundness in tangential-feed centerless grinding using a surface grinder, J. of Materials Processing Technology, 210 (2010) 759-766.
25. Y. Wu*, S. Yokoyama, T. Sato, W. Lin, T. Tachibana, Development of a new rotary ultrasonic spindle for precision ultrasonically assisted grinding， Int. J. of Machine Tools and Manufacture, 49, 12/13 (2009) 933-938.
26. T. Furuya, Y. Wu*, M. Nomura, Y. Shimada and K. Yamamoto, Fundamental performance of magnetic compound fluid polishing liquid in contact-free polishing of metal surface, J. of Materials Processing Technology, 201 (2008) 536-541.